|
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
  Defect
Characterization
|
Currently,
in the case of CMP process characterization, defectivity evaluation has
been getting more and more attention in addition to planarity evaluation.
The planarity evaluation has been carried out by a thin film measurement
system(such as KLA-Tencor F-5 or Thermaware Optiprobe 3000 Series system)
and a profiler (such as KLA-Tencor HRP 300 Series system, Veeco AFP 300
Series system or PSIA XE-300P system). In the case of defect characterization,
CMP industry has been using two different types of optical characterization
systems depending upon the wafer types. In the case of blanket film wafers,
KLA-Tencor 6420 or KLA-Tencor SP1 system has been widely used while the
defect characterization of CMP patterned wafers has been mostly performed
by KLA-Tencor, AIT-II(or III), KLA-Tencor 2139, KLA-Tencor 2351, COMPASS,
Orbot WF736, or KLA-Tencor STEALTH system. The cost of these defect inspection
systems is typically around $2.0 -$3.0 million. In addition, an experienced
specialist(s) is(are) needed to set up the optimum recipes for measurements
and to interpret the data. Due to these reasons, in the case of most CMP
infrastructure companies, there is the urgent need for outside defect
characterization support services. |
|
SKW
Associates, Inc.
|